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Requirements The substrate must be firm, dry, clean, and load-bearing, as well as freefrom sinter layers, efflorescence and release agents. Damp or not fully cured substratescan lead to defects in subsequent coats, such as blistering or cracks. Therefore do notapply to damp or soiled substrates.
Requirements The substrate must be firm, dry, clean, and load-bearing, as well as freefrom sinter layers, efflorescence and release agents. Damp or not fully cured substratescan lead to defects in subsequent coats, such as blistering or cracks. Therefore do notapply to damp or soiled substrates.
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